Power-supply unit for electronic oven

ABSTRACT

A Hall element (H) is arranged a choke coil ( 30 ) having an air gap at the core portion thereof. Power semiconductor elements (P 1 ) and (P 2 ) are attached at a heat radiation fin ( 61 ) directly by soldering. A rectangular-hollow-shaped core ( 27 ) formed by a metal core winding a long metal thin plate plural turns in rectangular-hollow-shape is fitted to the bar shaped ferrite core ( 26 ) from outside of the primary winding ( 21 ) and the secondary winding ( 22 ). The inner diameter of one side of the rectangular-hollow-shape is larger than both outer diameters of the primary winding ( 21 ) and the secondary winding ( 22 ) and the inner diameter of the other side of the rectangular-hollow-shape is larger than piled length of the primary winding ( 21 ) and the secondary winding ( 22 ). At the above state, the rectangular-hollow-shape ( 27 ) core is arranged having an air gap (G).

TECHNICAL FIELD

[0001] The invention relates to a power-supply unit for an electronic oven, particularly to a power-supply unit having a choke coil, a power element, booster transformer and the like and realizing miniaturization, lightweight, low cost and high reliability.

BACKGROUND ART

[0002]FIG. 9 is a constructing view of a general magnetron drive power-supply unit having a choke coil, a power element, booster transformer, and the like. In the figure, alternating current from a commercial power-supply 11 is rectified to direct current by a rectifying circuit 13, the rectified current is smoothed by a choke coil 14 and a filter capacitor 15 which are provided at output side of the rectifying circuit 13, and the smoothed current is applied to input side of an inverter 16. Direct current is converted to the desired high frequency (20 to 40 kHz) by on/off of a semiconductor-switching element in the inverter 16. The inverter 16 includes two groups of switching element groups for switching direct current with high speed where plural power MOSFET are connected in parallel for example, and a drive circuit driving these switching element groups. The drains of the powerMOSFET constituting the switching element groups are connected to one end and the other end of a primary winding 181 of a booster transformer 18 respectively, both sources of the power MOSFETs constituting these two switching groups are connected, and further gates of the power MOSFETs constituting the switching groups are connected to the switching element drive circuit respectively. The switching element groups constituted by the power MOSFETs are driven by an inverter control circuit 161, and current flowing through primary side of the booster transformer 18 is switched on/off with high speed.

[0003] Primary side current of the rectifying circuit 13 is detected by a CT 17 as an input signal of the control circuit 161, the detected current is inputted to the control circuit 161 so as to use for control of the inverter 16.

[0004] The choke coil 14 and the filter capacitor 15 perform a function that high frequency noise does not transmit to the commercial power-supply 11 at converting to high frequency from direct current, therefore, the choke coil 14 and the filter capacitor 15 have inductance and capacitance of degree to remove the high frequency noise.

[0005] In the case that the core of the choke coil 14 is small, large rush current flows by rapid saturation state so as not to perform the role. In contrast, in the case that a large core is used, the coil does not saturate, however there is a demerit that the choke coil itself becomes large size and weight thereof becomes heavy. Then, the problem of saturation is solved by using a choke coil winding a matter having a slit to longitudinal direction of a tube-shaped core as shown in FIG. 8 with electric wire.

[0006] In the booster transformer 18, high frequency voltage being output of the inverter 16 is applied to the primary winding 181, and high voltage corresponding to turn ratio is obtained at a secondary winding 182. A winding 183 little in number of turns is provided at the secondary side of the booster transformer 18, and is used for heating a filament 121 of the magnetron 12. At the side of the secondary winding 182 of the booster transformer 18, a voltage doubler half-wave rectifying circuit 19 is provided to rectify the output of the booster transformer 18. The voltage doubler half-wave rectifying circuit 19 includes a high voltage capacitor 191 and two high voltage diodes 192 and 193, the high voltage capacitor 191 and the high voltage diode 192 are conductive at positive cycle (an upper end of the secondarywinding182 is positive for example in the figure), and electric charge is charged positive to left side of the electrode plate of the high voltage capacitor 191 in the figure, negative to right side of the electrode plate. Next, at negative cycle (a lower end of the secondary winding 182 is positive), the high voltage diode 193 is conductive, and doubler voltage plus voltage of the high voltage capacitor 191 previously charged and the secondary winding 182 is applied between an anode 122 and a cathode 121 of the magnetron 12.

[0007]FIG. 7 shows an example of mounting the conventional power-supply unit for electronic oven on a printing board. The mounting example shows that the booster transformer 20′ supplying power to a magnetron (not shown), the CT, the choke coil 30′, and a heat radiation fin 60′ are provided on the printing board 80.

[0008] Thus, in the conventional unit, a current transformer CT (17 in FIG. 9) detecting the primary side current of the rectifying circuit 13 (FIG. 9) is provided on the board. Turn ratio of the CT is about 1:2000, current flowing through one wind can be detected with minute current of {fraction (1/2000)}, and the CT transmits to the inverter control circuit with low loss.

[0009] The choke coil 30′ is provided on the board.

[0010]FIGS. 8A to 8C are views explaining the choke coil 30′, FIG. 8A is a plane view, FIG. 8B is a front view, and FIG. 8C is a perspective view. In the figures, symbol 31 is a cylindrical core constructed by high permeability material (ferrite material for example). Symbol 32 is a winding wound large numbers of windings over inside and outside of the cylindrical core 31, symbol 33 is a resin covering whole the cylindrical core 31, and the cylindrical core 31 and the winding 32 are insulated by the resin. Symbol 34 is an air gap for depressing saturation because the high permeability material such as ferrite and the like saturates rapidly at large current.

[0011] Returning to FIG. 7, the booster transformer 20′ provided on the board shows an example of a conventional booster transformer using a ferrite core. In FIG. 7, a primary winding 201, a secondary winding 202, and a heater winding 203 are arranged in parallel on the same axis of two facing horseshoe-shaped ferrite cores 204 and 205. In the case of power-supply for magnetron drive dealing frequently large power, zero volt switching system (ZVS system hereafter) by voltage resonance prevails. In the ZVS system, it is necessary to set the coupling coefficient of the booster transformer at about 0.6 to 0.85 to obtain resonance voltage, therefore, an air gap G is provided. Thus, the booster transformer 20′ converts low voltage applying the primary winding 201 to high voltage corresponding to turn ratio to generate at the secondary winding 202 without saturation even at large current.

[0012] The heat radiation fin 60′ is provided with a power semiconductor element at the state of a package P in which the power semiconductor element is covered with molding resin. By providing the heat radiation fin 60′, heat generated at the power semiconductor element is transmitted to the heat radiation fin 60′ through the package P, the power semiconductor element is not heated because the heat is diffused efficiently from here, therefore heat failure of the power semiconductor element does not generate.

[0013] Since the CT is large, that is turn ratio thereof is 1:200 as above-mentioned, the space of the CT occupied on the board is not be neglected.

[0014] In the case of the prior booster transformer using two facing horseshoe-shaped ferrite cores 204 and 205, it is necessary to increase peak current flowing through the primary side of the booster transformer in order to make output of the magnetron further high in the booster transformer 20′ . By that, the ferrite core becomes easy to saturate because saturation magnetic flux density characteristic is bad, and large size of the ferrite core is necessary for not saturation. This is obstruction of miniaturization of the power-supply.

[0015] Since the heat radiation fin 60′ is in the state of the package P in which the power semiconductor element is covered with mold resin, heat generated at the power semiconductor element is transmitted to the heat radiation fin 60′ through the package P so that heat radiation performance is not good completely.

[0016] To solve the fault, the invention provides a power-supply unit for electronic oven enabling to detect current without using the CT and realizing miniaturization, lightweight, and low cost by miniaturizing the booster transformer and by the small size heat radiation fin in which cooling efficiency of the power semiconductor element is made high.

DISCLOSURE OF THE INVENTION

[0017] To solve the above problems, according to the power-supply unit for electronic oven, the unit provides a rectifying circuit, a choke coil provided at output side of the rectifying circuit, an inverter converting direct current to high frequency electric power by switching of a power semiconductor element, an inverter control circuit controlling the inverter, and a booster transformer boosting output voltage of the inverter on a board, wherein the choke coil has an air gap at the core portion, and a Hall element is arranged at the air gap.

[0018] Preferably, output signal of the Hall element is transmitted to the inverter control circuit in the power-supply unit for electronic oven.

[0019] According to the above invention, since a CT becoming large because of turn ratio of 1:2000 as described above is not necessary to use, the power-supply unit of miniaturization, lightweight, and low cost is obtained.

[0020] Further, the power semiconductor element is attached at the heat radiation fin directly by soldering in the power-supply unit for electronic oven.

[0021] According to the above invention, since that the power semiconductor element is attached at the heat radiation fin directly, heat radiation efficiency improves, further the power-supply unit of miniaturization, lightweight, and low cost is obtained.

[0022] Moreover, the power semiconductor element is attached at the heat radiation fin directly through a punching copper plate by soldering in the power-supply unit for electronic oven.

[0023] According to the above invention, since the power semiconductor element is attached at the heat radiation fin directly through a punching copper plate, the power-supply unit of further miniaturization, lightweight, and low cost is obtained because heat radiation efficiency improves and high density mounting is possible.

[0024] Further, the booster transformer is a magnetron drive booster transformer in which a primary winding and a secondary winding surround a bar shaped ferrite core, a rectangular-hollow-shaped core is fitted facing to the bar shaped ferrite core from outside of the primary winding and the secondary winding, and is arranged putting the air gap between axis direction end portion of the bar shaped ferrite core and surrounding edge of the rectangular-hollow-shaped core in the power-supply unit for electronic.

[0025] According to the above invention, since a ferrite core little in high frequency loss is provided as a main core and a rectangular-hollow-shaped core is provided having an air gap facing to the core, the invention contributes to the power-supply unit of further miniaturization, lightweight, and low cost because the construction is small size, strong, and further protects outside of each winding mechanically.

[0026] Still further, the booster transformer is a magnetron drive booster transformer in which a primary winding and a secondary winding surround a bar shaped ferrite core, a rectangular-hollow-shaped core is fitted facing to said bar shaped ferrite core from outside of the primary winding and the secondary winding, and is arranged putting the air gap between axis direction end portion of the bar shaped ferrite core and inside of the rectangular-hollow-shaped core in the power-supply unit for electronic oven.

[0027] According to the above invention, since a ferrite core little in high frequency loss is provided as a main core and a rectangular-hollow-shaped core is provided having an air gap facing to the core, the invention contributes to the power-supply unit of further miniaturization, lightweight, and low cost because the construction is small size, strong, and further protects outside of whole of each winding including the ferrite core mechanically.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028]FIG. 1 is view of construction of a magnetron driving power-supply using a choke coil, a power element, a booster transformer, and the like according to the invention;

[0029]FIG. 2 is a view showing an example of mounting attaching a power-supply unit for electronic oven according to the invention on a printing board;

[0030]FIGS. 3A to 3C are views showing explaining a choke coil according to the invention, FIG. 3A is a plane view, FIG. 3B is a front view, and FIG. 3C is a perspective view;

[0031]FIGS. 4A to 4D are views showing a first example of a booster transformer according to the invention, FIG. 4A is a front view, FIG. 4B is a plane view, FIG. 4C is a side view, and FIG. 4D is a perspective view;

[0032]FIGS. 5A to 5D are views showing a second example of a booster transformer according to the invention, FIG. 5A is a front view, FIG. 5B is a plane view, FIG. 5C is a side view, and FIG. 5D is a perspective view;

[0033]FIGS. 6A to 6C are views showing concrete three examples attaching a power semiconductor element directly at a heat radiation fin;

[0034]FIG. 7 is a view showing an example attaching the conventional power-supply unit for electronic oven on a printing board;

[0035]FIGS. 8A to 8C are views explaining the conventional choke coil, FIG. 8A is a plane view, FIG. 8B is a front view, and FIG. 8C is a perspective view; and

[0036]FIG. 9 is a conventional construction of a magnetron driving power-supply using a choke coil, a power element, a booster transformer, and the like.

BEST MODE FOR CARRYING OUT THE INVENTION

[0037]FIG. 2 shows an example of mounting according to the invention attaching a power-supply unit for electronic oven on a printing board. On a printing board 80, a booster transformer 20, a choke coil 30, and a heat radiation fin 60 for radiating heat loss of a package including a power semiconductor element according to the invention respectively are provided.

[0038] First, the choke coil 30 according to the invention will be described. In the invention, a Hall element, not a CT, is used for detecting current. The Hall element generates voltage in proportion to magnetic field applied, i.e., Hall voltage, therefor, magnetic field generating in proportion to current flowing through the current passage acts to the Hall element so as to obtain voltage in proportion to the current from the Hall element by arranging the Hall element along a current passage. As an example of concrete circuit construction, Japanese Unexamined Utility Model Publication No. S61-52272 is disclosed for example. In the publication, magnetic flux generating in a magnetic core by current flowing through a winding is converted to voltage by a Hall element so as to obtain current value detected from the voltage by winding the magnetic core with wire where current to be detected flows, by providing an air gap at the magnetic, and by arranging the Hall element at the air gap.

[0039] The invention applies this principle, and it is tried to use the magnet core type Hall element with air gap instead of the CT 17 of FIG. 9. As the result, good current detection is obtained similarly as the case of using the CT 17 and it is satisfied.

[0040] However, since only using the Hall element instead of the CT 17 does not contribute to miniaturization, lightweight, and low cost of the power-supply unit, the applicant tried further experiment and improvement. As the result, the applicant noticed that input current value and output current value of the rectifying circuit 13 in FIG. 9 are in proportional relation as a numerical value though directions of positive and negative are different, and tried to provide a magnetic core type Hall element with an air gap at output side of the rectifying circuit 13. However, only using the Hall element at output side of the rectifying circuit 13 does not contribute to miniaturization, lightweight, and low cost of the power-supply unit.

[0041] Then, the applicant aimed at that choke coil 14 of FIG. 9 has a magnetic core structure with air gap and tried to arrange the Hall element at the air gap.

[0042] FIGS. 3Ato 3C are views explaining a choke coil according to the invention, FIG. 3A is a plane view, FIG. 3B is a front view, and FIG. 3C is a perspective view. In the figures, symbol 30 is a choke coil according to the invention, and symbol 31 is a cylindrical core constructed by high permeability material (ferrite material for example). Symbol 32 is a winding wound large numbers of windings over inside and outside of the cylindrical core 31, symbol 33 is a supporting body for supporting the cylindrical core 31 and the winding, and symbol 34 is an air gap provided so that high permeability material such as ferrite and the like does not saturate. Further, in the present invention, a Hall element H is arranged at the air gap 34.

[0043] As a magnet sensing film of the Hall element H, for example, InSb having high mobility and good sensibility, or GaAs having large energy band gap width and good temperature characteristic, is used. In the construction thereof, after forming the magnet sensing film such as InSb, InAs, GaAs, and the like on a surface of a semi-insulating GaAs substrate by implanting Si and so on, patterning to the desired pattern is performed, an inner electrode is formed at the magnet sensing film to allow the current to flow to an inorganic protecting film such as SiO₂, SiN and the like, and then, dicing, die bonding and wire bonding are performed, and the Hall element is molded with resin connecting wire to the electrode.

[0044]FIG. 1 is a constructing view of a magnetron drive power-supply unit according to the present invention.

[0045] Output signal of the Hall element H is transmitted to an inverter circuit 161. In this case, since it is not necessary to provide the CT 17 for detecting input current of the rectifying circuit 13 as the conventional power-supply unit, the CT 17 is detached.

[0046] By the above description, the choke coil 14 having been used obtains the same current detecting effect as usual with the same shape and does not use the CT 17 so that the power-supply unit is miniaturized, becomes lightweight, and becomes low cost.

[0047] Returning to FIG. 2, the booster transformer 20 provided on the board 80 concerns the invention aiming at miniaturization of the unit, a ferrite core a little in high frequency loss is provided for a main core 26, the air gap G is provided so as not to saturate, and a small sized metal core 27 hard to saturate is arranged at outside of a primary winding 21, a secondary winding 22, and a heater winding 23 facing the gap.

[0048]FIGS. 4A to 4D are views showing the booster transformer 20 in detail, FIG. 4A is a front view, FIG. 4B is a plane view, FIG. 4C is a side view, and FIG. 4D is a perspective view. In the figure, symbol 20 is a booster transformer according to a first example of the invention, symbol 21 is a primary winding, symbol 22 is a secondary winding, and symbol 23 is a heater winding. The primary winding 21 is large in section of winding and little in number of turns comparing with the secondary winding 22. The heater winding 23 is extremely little in number of turns comparing with the secondary winding 22, therefore is not drawn in the figure. Since the heater winding 23 may be constructed by another parts, it is not an essential part here. Symbol 26 is a bar-shaped ferrite core, and a rectangular parallelepiped shape is adopted here. The primary winding 21, the secondary winding 22, and the heater winding 23 surround periphery of the rectangular parallelepiped shaped ferrite core 26 respectively, and they are arranged in piles to axis direction of the core.

[0049] Symbol 27. is a metal core adopted by the invention, and is produced by winding a long metal thin plate including amorphous, silicon steel plate, and the like, in a rectangular hollow shape plural times (about 10 to 40 turns), and by insulating between each layers. Among the inner diameter of the rectangular-hollow-shaped metal core, one inner diameter (inner diameter of right and left direction of the metal core 27 in FIG. 4C) is made larger than any of the outer diameters of the primary winding 21, the secondary winding 22,. and the heater winding 23, and the other inner diameter (inner diameter of up and down direction of the metal core 27 in FIG. 4C) is formed larger than the piled length of three windings of the primary winding 21, the secondary winding 22, and the heater winding 23.

[0050] Therefore, the metal core 27 in the figures is fitted to the primary winding 21, the secondary winding 22, and the heater winding 23 from outside thereof facing the ferrite core 26, and is arranged facing the ferrite core keeping the air gap G to the bar shaped ferrite core 26 as shown in FIG. 4D. The gap between the ferrite core 26 and the metal core 27 is about 0.3 to 0.8 mm.

[0051] By the above construction, a ferrite core little in high frequency loss is provided for a main core, the air gap is provided so as not to saturate, and a small sized metal core hard to saturate is arranged at outside of the primary winding 21, the secondary winding 22, and the heater winding 23 facing the gap, so the construction makes a substantial contribution for miniaturization comparing with the conventional booster transformer 20′ (FIG. 7) consisting of only the ferrite core. That is, in the conventional booster transformer 20′, a part of the ferrite core arranged at outside of the primary winding 21, the secondary winding 22, and the heater winding 23 is constructed by the almost same cross-sectional area as a part of the main ferrite core, so projects on a large scale to outside of the primary winding 21, the secondary winding 22, and the heaterwinding23. On the other hand, in the booster transformer 20 according to the invention, cross-sectional area of the core is made extremely small comparing with the part of the ferrite core because of the metal core, therefore the core does not project to outside of the primary winding 21, the secondary winding 22, and the heater winding 23 (see FIG. 2).

[0052] Further, long metal thin plate turned 10 to 40 turns is used, and direction that eddy current flows to is put to direction crossing the metal thin plate layer turned many turns. Therefore, eddy current can hardly flow because eddy current does not flow in cross-sectional area of one metal thin plate and resistance value of cross-sectional area of one metal thin plate is large. Therefore, high-frequency loss, a fault of the metal core at high frequency, becomes small by not until arranging the metal core of such the construction like above even at high frequency so as to obtain a booster transformer having both good points of the ferrite core and the metal core.

[0053]FIGS. 5A to 5D are views showing a second example of a booster transformer according to the invention, FIG. 5A is a front view, FIG. 5B is a plane view, FIG. 5C is a side view, and FIG. 5D is a perspective view. In the figure, symbol 50 is the second example of the booster transformer according to the invention. Symbol 21 is a primary winding, symbol 22 is a secondary winding, and symbol 23 is a heater winding, they are the same as them of FIG. 2. That is, the primary winding 21 is large in section of winding and little in number of turns comparing with the secondary winding 22. The heater winding 23 is extremely little in number of turns comparing with the secondary winding 22, therefore is not drawn in the figure.

[0054] Then, in the second example of the booster transformer according to the invention, a columnar ferrite core 56 is used, and the primary winding 21, the secondary winding 22, and the heater winding 23 surround the periphery of the core so as to put piling to axis direction of the core respectively.

[0055] A metal core of the booster transformer is produced by laminating plural pieces (10 to 40 Pieces) of rectangular-hollow-shaped metal thin plates to thickness direction using insulating adhesive. Among the inner diameter of the rectangular-hollow-shaped metal core, one inner diameter (inner diameter of right and left direction of the metal core 57 in FIG. 5C) is formed larger than any of the outer diameters of the primary winding 21, the secondary winding 22, and the heater winding 23, and the other inner diameter (inner diameter of up and down direction of the metal core 57 in FIG. 5C) is formed larger than the length of the column shaped ferrite core 56. Such the metal core 57 is fitted to the column shaped ferrite core 56 facing the ferrite core 56, and is arranged facing the end portion of axis direction of the ferrite core 56 keeping the air gap G as shown in FIG. 5D.

[0056] By the above construction, since the ferrite core little in high-frequency loss is used as a main core, the air gap is provided so as not to saturate, further the small size metal hard to saturate is arranged at outside of the primary winding 21, the secondary winding 22, the heater winding 23, and the ferrite core 56, the ferrite core contributes greatly to miniaturization comparing with the conventional booster transformer 20′ (FIG. 7) consisting of only ferrite core.

[0057] Further, 10 to 40 pieces of the metal thin plate 27 a is laminated, and direction that eddy current flows to is put to direction crossing the metal thin plate layer laminating many pieces. Therefore, eddy current can hardly flow because eddy current does not flow in cross-sectional area of one metal thin plate and resistance value of cross-sectional area of one metal thin plate is large.

[0058] Therefore, high frequency loss, a fault of the metal core 57 at high frequency becomes small by not until arranging the metal core 57 of such the construction like above even at high frequency so as to obtain a booster transformer having both good points of the ferrite core and the metal core.

[0059] Further, since the ferrite core of the booster transformer is columnar shape, it is easier than rectangular parallelepiped to produce. Since mutual facing parts of the ferrite core 56 and the metal core 57 are parallel at the air gap G where magnetic flux passes, the gaps G formed between them are the same width so as to become easy to design coupling coefficient and the like.

[0060] Still further, since the rectangular-hollow-shaped metal core 57 covers a part of the ferrite core 56 and each of windings 21, 22, and 23 from outside, the construction functions as these mechanical protection.

[0061] The heat radiation fin 60 of FIG. 2 according to the invention directly provided at the heat radiation fin without using a package for heat radiation of the power semiconductor element. FIGS. 6A to 6C show three concrete mounting examples attaching the power semiconductor element directly at the heat radiation fin 60, FIG. 6Ashowsanexamplebywirebondingmethod, FIG. 6B shows an example by die bonding method, and FIG. 6C shows an example by punching copper plate method.

[0062] In FIG. 6A by wire bonding method, symbols P1 and P2 are heating semiconductor elements, for example, the former is the power semiconductor element, the later is the semiconductor diode used in the inverter 16 (FIG. 1), both of them are element must be protected from overheat because they generate heat themselves. These power semiconductor elements P1 and P2, and the like are attached at the heat radiation fin 61 by soldering 62 directly according to the invention. Symbol 68 is a terminal provided at a printing board 80, symbol 67 is wires connecting the power semiconductor element P1, the semiconductor diode P2, and the terminal 68, and a compound portion C shown with a doted line; the power semiconductor element P1, the semiconductor diode P2, the soldering part 62, the terminal 68, and wires 67, is molded with resin.

[0063] By the mounting method, since the power semiconductor element P1 and the semiconductor diode P2 are attached at the heat radiation fin 61 by soldering 62 directly, heat is not radiated through the thermal conductivity resin as conventional heat radiation fin. Therefore, heat conduction becomes good, and reduction of the size of the heat radiation fin 61 is realized.

[0064] Since the heat radiation fin can get close to the power-supply circuit by making the heat radiation fin 61 small, drawing of wire becomes short and generation of noise is depressed.

[0065] Cooling efficiency greatly improves. Further, since the power semiconductor element P1 and the semiconductor diode P2 are connected to the terminal 68 of the board 80 by wire bonding 67, it is not necessary to use mounting means expensive as a double-sided mounting board so that low cost mounting is possible.

[0066] In FIG. 6B by die bonding method, symbols P1 and P2 are heating semiconductor elements such as the power semiconductor element, and these power semiconductor elements P1 and P2, and the like are attached at the heat radiation fin 61 by soldering 62 directly according to the invention. Symbol 64 is a double-sided board having through-holes and symbol 65 is an insulator. For the printing board 80, paper phenol of low cost is used. Symbol 65 is a solder bump provided at the electrode portions of the power semiconductor elements P1 and P2.

[0067] Since the power semiconductor element P1 and the semiconductor diode P2 are attached at the heat radiation fin 61 by soldering 62 directly by the mounting method, cooling efficiency improves sharply because the heat is not radiated through the thermal conductivity resin as the conventional heat radiation fin. Since the power semiconductor elements P1 and P2 are connected to the printing board 80 through the through-holes 64 and a terminal 66 of opposite side from the bump 65 provided at the power semiconductor elements P1 and P2, the driving circuit of the power semiconductor element can get close to the board. Therefore, ideal driving is performed removing parasitic inductor and resistance component of the driving circuit so that switching loss and noise are depressed.

[0068] Further, work of drawing the wire 67 by wire bonding method like FIG. 6A is omitted so that assembling becomes quick.

[0069] In FIG. 6C by punching copper plate method, symbols P1 and P2 are heating semiconductor elements such as the power semiconductor element, and these power semiconductor elements P1 and P2, and the like are attached partly at the heat radiation fin 61 by soldering 62 directly at the state arranged at a punching copper plate 69 according to the invention. Symbol 66 is a terminal connecting electrically to the printing board 80 using a punching copper plate similarly. By a compound portion C shown with a doted line, the power semiconductor element P1, the semiconductor diode P2, the soldering part 62, the terminal 66, and the punching copper plate board 69 are molded with resin.

[0070] Since the power semiconductor element P1 and the semiconductor diode P2 are attached at the heat radiation fin 61 by soldering 62 directly through the punching copper plate board 69 by the mounting method, cooling efficiency improves sharply because the heat is not radiated through thermal conductivity resin is not laid as the conventional heat radiation fin. Since the punching copper plate board 69 itself has role of heat sink, radiation efficiency is good. Since the power semiconductor elements P1 and P2 are connected to the printing board 80 through the punching copper plate boards 69 and the terminal 66, work of drawing the wire 67 by wire bonding method like FIG. 6A is omitted so that assembling becomes quick.

[0071] Further, since the double-sided board is not. necessary, cost becomes low. Since there is degree of freedom to thickness direction of the conductor by using the punching copper plate, whole of the circuit can be made small.

[0072] An example of a magnetron drive power-supply unit of the invention providing a choke coil, a power element, a booster transformer, and the like is shown above. However the driver power-supply is not limited to this, it maybe any type converting DC-AC and boosting using a choke coil, a power element, a booster transformer, and the like.

[0073] The present invention has been explained in detail by referring to a specific embodiment. However, it would be apparent to one having ordinary skill in the art that the present invention can be variously changed or modified without departing from the spirit and scope of the invention.

[0074] The present application is based on Japanese Patent Application No. 2002-67105 filed on Mar. 12, 2002, and the content thereof is referred to and taken in here.

[0075] Industrial Applicability

[0076] As described above, according to the invention, the power-supply unit for electronic oven provides a rectifying circuit, a choke coil provided at output side of the rectifying circuit, an inverter converting direct current to high frequency electric power by switching of a power semiconductor element, an inverter control circuit controlling the inverter, and a booster transformer boosting output voltage of the inverter on a board, wherein the choke coil has an air gap at the core portion, and a Hall element is arranged at the air gap. The power semiconductor element is attached at the heat radiation fin directly by soldering, and further the booster transformer is a magnetron drive booster transformer in which the primary winding and the secondary winding surround the bar shape core respectively. By arranging the rectangular-hollow-shaped core having an air gap facing to the bar shaped ferrite core at the state fitting to the bar shaped ferrite core from outside of the primary winding and the secondary winding, detecting current is possible without using the CT. By making the booster transformer and by the small sized heat radiation fin making cooling efficiency of the power semiconductor element, a power-supply unit for electronic oven being miniaturization, lightweight, and low cost. 

1. A power-supply unit for electronic oven comprising: a rectifying circuit; a choke coil provided at output side of the rectifying circuit and having an air gap at a core portion; an inverter for converting direct current to high frequency electric power by switching of a power semiconductor element; an inverter control circuit for controlling the inverter; a booster transformer boosting output voltage of the inverter on a board; and a Hall element arranged at the air gap the choke coil.
 2. The power-supply unit for electronic oven according to claim 1, wherein output signal of the Hall element is transmitted to said inverter control circuit.
 3. The power-supply unit for electronic oven according to claim 1, further comprising a heat radiation fin for radiating heat of said power semiconductor element provided on the board, wherein said power semiconductor element is attached at said heat radiation fin directly by soldering.
 4. The power-supply unit for electronic oven according to claim 1, further comprising a heat radiation fin for radiating heat of said power semiconductor element provided on the board, wherein said power semiconductor element is attached at said heat radiation fin directly through a punching copper plate by soldering.
 5. The power-supply unit for electronic oven according to claim 1, wherein said booster transformer is a magnetron drive booster transformer comprises: a bar shaped ferrite core; a primary winding and a secondary winding which are provided to surround said bar shaped ferrite core; a rectangular-hollow-shaped core provided to face to said bar shaped ferrite core from outside of said primary winding and the secondary winding, and to have an air gap between said bar shaped ferrite core and surrounding edge of said rectangular-hollow-shaped core.
 6. The power-supply unit for electronic oven according to claim 6 wherein said booster transformer is a magnetron drive booster transformer comprises: a bar shaped ferrite core; a primary winding and a secondary winding provided to surround said bar shaped ferrite core; a rectangular-hollow-shaped core provided to face to said bar shaped ferrite core from outside of said primary winding and the secondary winding, and to have an air gap between said bar shaped ferrite core and inside of said rectangular-hollow-shaped core. 